Introducing our Hybrid PCB,a revolutionary printed circuit board that combines multiple materials to unlock unparalleled performance and flexibility. By integrating diverse substrate materials within a single board, the Hybrid PCB empowers you to harness the unique properties of each material, allowing you to push the boundaries of your applications. Let's delve into the remarkable features and specifications that make this Hybrid PCB the ideal choice for your next project.
Powerful Features for Optimal Performance:
This Hybrid PCB is available in two variants: the RO4003C and the RO4350B, both engineered to deliver exceptional results in a variety of demanding applications. Here's a closer look at the remarkable features of each variant:
RO4003C:
- Dielectric Constant Dk of 3.38 +/- .05
- Dissipation factor of .0027 at 10GHz
- Thermal coefficient of Dk of 40 ppm/°K
- Coefficient of thermal expansion matched to copper: x y z - 11ppm/K, 14ppm/K, 46ppm/K
- Decomposition Temperature (Td) of 425 °C TGA
- Thermal Conductivity of 0.71W/mk
- Tg >280°C TMA
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
RO4350B:
- Dielectric Constant Dk of 3.48 +/- .05
- Dissipation factor of .0037 at 10GHz
- Thermal coefficient of Dk of 50 ppm/°K
- Coefficient of thermal expansion matched to copper: x y z - 10ppm/K, 12ppm/K, 32ppm/K
- Decomposition Temperature (Td) of 390 °C TGA
- Thermal Conductivity of 0.69W/mk
- Tg >280°C TMA
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Optimized PCB Stackup:
This Hybrid PCB features a 6-layer rigid construction, meticulously designed to maximize performance and reliability. The stackup includes copper layers, RogersRO4350B and RogersRO4003C cores, and RO4450F prepreg layers. This carefully crafted combination ensures efficient signal transmission and excellent thermal management, even under demanding conditions.
Precise Construction Details:
With this Hybrid PCB, precision is paramount. Here are the key construction details that set our board apart:
- Board dimensions: 32mm x 42mm, ensuring compatibility with various applications
- Minimum Trace/Space: 6/6 mils, enabling intricate circuitry design
- Minimum Hole Size: 0.4mm, facilitating seamless integration of components
- Finished board thickness: 1.6mm, striking a balance between compactness and durability
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity
- Via plating thickness: 20 μm, guaranteeing reliable electrical connections
- Surface finish: Immersion Gold, providing superior corrosion resistance and solderability
- Top Silkscreen: No, for a sleek and minimalistic appearance
- Bottom Silkscreen: No, maintaining a clean and professional aesthetic
- Top Solder Mask: Green, for enhanced protection and visual distinction
- Bottom Solder Mask: No, ensuring a streamlined design
- 100% Electrical test: Each board undergoes rigorous testing to ensure flawless functionality prior to shipment.
Uncompromising Quality and Standards:
This Hybrid PCB adheres to the IPC-Class-2 quality standard, guaranteeing exceptional workmanship and reliability. We take pride in delivering products that meet and exceed industry benchmarks, enabling you to achieve outstanding results in your applications.
Endless Possibilities, Worldwide Availability:
The versatility of our Hybrid PCB makes it an ideal choice for a wide range of applications, including:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites
Whether you're designing next-generation wireless communication systems or advanced automotive electronics, the Hybrid PCB empowers you to realize your vision, unlocking new possibilities for innovation.
Harness the Power of Hybrid PCB Technology:
Experience the future of electronic design with the Hybrid PCB. With its unmatched combination of materials, exceptional performance features, and meticulous craftsmanship, our Hybrid PCB is the ultimate solution for your circuitry needs.
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Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished Images
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