Introducing our newly shipped PCB featuring RO4835, a high-performance laminate from Rogers. Designed for high frequency applications and cost-effective circuit fabrication, RO4835 offers enhanced stability at high temperatures and improved oxidation resistance compared to other hydrocarbon materials. This low loss laminate provides excellent electrical performance, making it ideal for performance-sensitive and high-volume applications.
Key Features:
- RoHS compliant and IPC-4103 compliant for safety and reliability
- Dielectric constant (Dk) of 3.48 +/- .05 for controlled impedance transmission lines
- Dissipation factor of 0.0037 at 10 GHz, ensuring low insertion loss
- Glass Transition Temp (Tg) >280 °C TMA for high-temperature operation
- Coefficient of Thermal Expansion of 10 ppm/°C on the X-axis, 12 ppm/°C on the Y-axis, and 31 ppm/°C on the Z-axis for stable performance over varying temperatures
Benefits:
- Enhanced oxidation resistance, ensuring reliable and durable performance
- Designed for high volume applications, offering a cost-effective solution
- Low loss characteristics enable application with higher operating frequencies, making it suitable for automotive applications
- Tight dielectric constant tolerance for controlled impedance transmission lines
- Lead-free process compatible, preventing blistering or delamination issues
- Low Z-axis expansion ensures reliable plated through holes
- Low in-plane expansion coefficient maintains stability during circuit processing temperatures
| Property | RO4835 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | - | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -100℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 108 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 7 x108 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 30.2(755) | Z | Kv/mm(v/mil) | | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 7780(1128) | Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 136(19.7) | Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 186 (27) | | Mpa (kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mils/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
31 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.66 | | W/m/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.05 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.92 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88 (5.0) | | N/mm (pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
This PCB stackup features a 2-layer rigid configuration with finished copper thickness of 35 μm. The RO4835 dielectric layer has a thickness of 10 mil (0.254 mm), providing excellent electrical performance. The construction details include a board size of 55.46 mm x 41.5 mm for compact and versatile applications. The minimum trace/space is set at 5/5 mils, allowing for precise routing. The minimum hole size is 0.4 mm, accommodating various components and connectors.
This PCB does not include blind or buried vias, simplifying the manufacturing process. The finished board thickness is 0.3 mm, striking a balance between durability and space constraints. The finished copper weight is 1 oz (1.4 mils) on all layers, ensuring sufficient conductivity. Via plating thickness is 1 mil, providing reliable electrical connections. The surface finish is immersion gold, offering excellent solderability and a flat surface for component mounting.
For marking and identification, the top silkscreen is in white, providing clear labeling. The bottom silkscreen is not present in this configuration, keeping the design streamlined. The top solder mask is blue, offering protection against solder bridging. The bottom solder mask is not applied.
Each PCB has undergone a 100% electrical test to ensure quality and reliability. PCB statistics indicate that it comprises 27 components and has a total of 56 pads. Among these pads, 34 are through-hole pads, while 21 are top surface-mount technology (SMT) pads. The bottom SMT pads are not present in this configuration. The PCB features 41 vias for interconnection between different layers and components. The board has 2 nets, representing the interconnected pathways for signal transmission.
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4835 |
| Dielectric constant: | 3.48 (10 GHz) |
| Dissipation Factor | 0.0037 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (ED copper) | 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| Dielectric thickness (LoPro copper) | 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
The artwork supplied for production is Gerber RS-274-X, a widely accepted format in the industry. PCB conforms to IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.
Our PCB is available for worldwide shipping, providing easy access to this high-performance solution.
Typical applications for this PCB include automotive radar and sensors, point-to-point microwave systems, power amplifiers, phased-array radar, and RF components.
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10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold Images
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