Introducing the RT/duroid 6035HTC PCB, a high-performance solution designed for high power RF and microwave applications. Manufactured using Rogers Corporation's advanced high-frequency circuit materials, this PCB offers exceptional reliability and power handling capabilities.
Features:
DK: 3.5 +/- 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0013 at 10 GHz/23°C
Thermal Coefficient of Dielectric Constant: -66 ppm/°C
Moisture Absorption: 0.06%
Thermal Conductivity: 1.44 W/m/K at 80°C
CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.6 | Z | | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor | 0.0013 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | | MΩ.cm | A | IPC-TM-650, 2.5.17.1 |
| Surface Resistivity | 108 | | MΩ | A | IPC-TM-650, 2.5.17.1 |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | | W/m/k | 80℃ | ASTM C518 |
| Density | 2.2 | | gm/cm3 | 23℃ | ASTM D792 |
| Copper Peel Stength | 7.9 | | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-Free Process Compatible | Yes | | | | |
Benefits:
High Thermal Conductivity: Enables efficient heat dissipation and lower operating temperatures for high-power applications.
Excellent High Frequency Performance: Low insertion loss and reliable thermal stability of traces ensure optimal signal integrity.
Superior Power Handling: Designed to handle high power RF and microwave applications with exceptional reliability.
The RT/duroid 6035HTC PCB is a 2-layer rigid PCB with a copper layer thickness of 35 μm on each side and an RT/duroid 6035HTC core thickness of 0.254 mm (10 mils). With board dimensions of 42.91mm x 108.31mm, it provides ample space for your designs while maintaining a compact form factor.
This PCB supports intricate and precise circuit designs, offering a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm. It has a finished board thickness of 0.3mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, ensuring durability and reliability.
| PCB Material: | Ceramic-filled PTFE composites |
| Designation: | RT/duroid 6035HTC |
| Dielectric constant: | 3.50±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
The RT/duroid 6035HTC PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, meeting IPC-Class-2 quality standards. It is available worldwide, ensuring easy access to this high-performance solution.
With 35 components, 112 total pads, 74 thru-hole pads, 38 top SMT pads, and 64 vias, the RT/duroid 6035HTC PCB offers versatility and flexibility for your designs. It finds applications in high-power RF and microwave amplifiers, power amplifiers, couplers, filters, combiners, and power dividers.
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10mil RT Duroid 6035HTC PCB Double-layer Black Silkscreen Immersion Gold Images
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