Introducing the F4BTME298 PCB, a high-performance printed circuit board engineered for demanding applications. This PCB is constructed using advanced F4BTME laminates, which are meticulously manufactured through a specialized process that combines glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. The result is a substrate that excels in high-frequency performance, thermal stability, and insulation.
Key Features
Dielectric Constant (Dk): 2.98 ±0.06 at 10 GHz, ensuring superior signal integrity.
Dissipation Factor: Exceptionally low at 0.0018 at 10 GHz and 0.0023 at 20 GHz, minimizing energy loss.
Thermal Performance: Coefficient of thermal expansion (CTE) values of 15 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 78 ppm/°C (Z-axis), with operating temperatures from -55°C to 288°C.
Low Moisture Absorption: Only 0.05%, maintaining performance in humid conditions.
Passive Intermodulation (PIM): Outstanding performance with a PIM value of <-160 dBc.
| Product Features |
Test Conditions |
Unit |
F4BTME298 |
F4BTME300 |
F4BTME320 |
F4BTME350 |
| Dielectric Constant (Typical) |
10GHz |
/ |
2.98 |
3.0 |
3.2 |
3.5 |
| Dielectric Constant Tolerance |
/ |
/ |
±0.06 |
±0.06 |
±0.06 |
±0.07 |
| Loss Tangent (Typical) |
10GHz |
/ |
0.0018 |
0.0018 |
0.0020 |
0.0025 |
| 20GHz |
/ |
0.0023 |
0.0023 |
0.0026 |
0.0035 |
| Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
| Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
| 1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
| Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
| Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
| Electrical Strength (Z direction) |
5KW,500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
| Breakdown Voltage (XY direction) |
5KW,500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
| Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15,16 |
15,16 |
13,15 |
10,12 |
| Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
| Thermal Stress |
260℃, 10s,3 times |
No delamination |
No delamination |
No delamination |
No delamination |
| Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
| Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
| Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
| Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
| PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
| Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
| Material Composition |
/ |
/ |
PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
PCB Stackup Configuration
This PCB features a robust 2-layer rigid stackup:
Copper Layer 1: 35 μm
Core Material: F4BTME298 (1.524 mm / 60 mil)
Copper Layer 2: 35 μm
This configuration results in a finished board thickness of 1.6 mm, with a total copper weight of 1 oz (1.4 mils) across the outer layers.
Construction Details
Board Dimensions: 51.51 mm x 111.92 mm (±0.15 mm)
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.3 mm
Vias: 41 total, with no blind vias included.
Surface Finish: Immersion Tin for excellent solderability.
Silkscreen and Solder Mask: Features a white top silkscreen and a green top solder mask; no bottom silkscreen or solder mask.
Each PCB undergoes rigorous 100% electrical testing prior to shipment to ensure reliability and performance.
Quality Assurance
This PCB meets the IPC-Class-2 quality standard, ensuring high reliability for various applications.
Applications
The F4BTME298 PCB is ideal for a wide range of applications, including:
Aerospace and cabin equipment
Microwave and RF technologies
Military radar systems
Feed networks
Phase-sensitive and phased array antennas
Satellite communications
Availability
The F4BTME298 PCB is available for global, making it accessible for engineers and designers worldwide seeking high-performance solutions for their projects.
| PCB Material: |
PTFE / glass fiber cloth / Nano-ceramic filler |
| Designation (F4BTME ) |
F4BTM |
DK (10GHz) |
DF (10 GHz) |
| F4BTME298 |
2.98±0.06 |
0.0018 |
| F4BTME300 |
3.0±0.06 |
0.0018 |
| F4BTME320 |
3.2±0.06 |
0.0020 |
| F4BTME350 |
3.5±0.07 |
0.0025 |
| Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (or overall thickness) |
0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
Product Tags:
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