Introducing our newly shipped 4-layer printed circuit board (PCB) engineered with high-performance materials—Rogers RT/duroid 5880 and RO4003C. This PCB is designed for high-frequency and broadband applications, offering exceptional electrical properties and reliability.
Material Introductions
RT/duroid 5880
Rogers RT/duroid 5880 is a high-frequency laminate made from PTFE composites reinforced with glass microfibers. This material features:
- Low Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz
- Low Loss: Dissipation factor of 0.0009 at 10 GHz
- Uniformity: Randomly oriented microfibers enhance Dk stability.
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
RO4003C
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that combines:
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Cost-Effectiveness: Utilizes standard epoxy/glass processing methods.
- Low Moisture Absorption: 0.06%, enhancing reliability.
| |
| RO4003C Typical Value |
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
PCB Specifications
Stackup:
Copper Layer 1: 35 μm
RT/duroid 5880: 0.787 mm (31 mil)
Copper Layer 2: 35 μm
RO4450F Prepreg Bondply: 0.101 mm (4 mil)
Copper Layer 3: 35 μm
RO4003C: 0.203 mm (8 mil)
Copper Layer 4: 35 μm
This PCB measures 110 mm x 51 mm ± 0.15 mm, with a finished thickness of 1.3 mm and a copper weight of 1 oz (1.4 mils) on both inner and outer layers. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3 mm, with a via plating thickness of 20 μm.
For surface finish, it uses immersion gold, complemented by a green solder mask on the top side and no mask on the bottom. A white silkscreen is applied on the top for clear component labeling. Each PCB is 100% electrically tested before shipment to ensure high quality and reliability.
Typical Applications
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point-to-Point Digital Radio Antennas
Quality Assurance
This PCB meets IPC-Class 2 standards and is supplied with Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software.
Global Availability
Available for worldwide shipping, our advanced PCB technology is ready to support your high-frequency application needs.
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4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold Images
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