We are proud to present our cutting-edge 8-layer printed circuit board (PCB), meticulously engineered using high-quality RO4350B materials. This PCB is specifically designed to meet the demands of high-performance electronic applications, delivering exceptional reliability and efficiency across a wide range of environments.
Key Specifications
- Base Material: Our PCB utilizes premium RO4350B, renowned for its electrical performance and manufacturability.
- Layer Count: The board consists of 8 layers, allowing for complex designs and enhanced functionality.
- Board Dimensions: Measuring 96.4 mm x 163.9 mm (with a tolerance of ±0.15 mm), this board is compact yet spacious enough to accommodate various components.
- Minimum Trace/Space: The design includes fine traces and spaces of 4/6 mils, ensuring high-density layouts.
- Minimum Hole Size: Features a minimum hole size of 0.4 mm, suitable for a wide range of components.
- Finished Board Thickness: The completed board boasts a thickness of 1.8 mm, providing strength and durability.
- Finished Copper Weight: The outer layers have a copper weight of 1 oz (1.4 mils), while the inner layers feature a combination of 1 oz (1.4 mils) and 0.5 oz (0.7 mils).
- Surface Finish: Our boards come with an Electroless Nickel Immersion Gold finish, enhancing solderability and protecting against oxidation.
- Silkscreen: The top and bottom layers are marked with white silkscreen for clear identification of components.
- Solder Mask: Both sides of the board are coated with a green solder mask for added protection and aesthetic appeal.
- Vias: All vias are resin filled and capped, ensuring reliable connections and improved thermal performance.
- Electrical Testing: Each board undergoes a rigorous 100% electrical test prior to shipment, guaranteeing functionality and performance.
- Impedance Control: Impedance is meticulously controlled at 50 ohms on specified layers, enhancing signal integrity.
Construction Details
This advanced PCB features a sophisticated stackup that combines multiple layers of Rogers RO4350B and RO4450F bondply materials. This unique construction not only provides excellent thermal stability but also ensures superior electrical performance, making it ideal for high-frequency applications. The tight control over dielectric properties allows for reliable operation in demanding environments.
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Performance Features
- Dielectric Constant (RO4350B): The dielectric constant is maintained at 3.48 ± 0.05 at 10 GHz, minimizing signal loss.
- Thermal Conductivity: With a thermal conductivity of 0.69 W/m/°K, this PCB effectively dissipates heat, enhancing overall performance.
- High Tg (>280 °C): The high glass transition temperature ensures stability during processing and operational reliability.
- Low Water Absorption: The material exhibits a low water absorption rate of 0.06%, further enhancing its durability in various conditions.
Applications
This 8-layer PCB is versatile and well-suited for an array of applications, including but not limited to:
- Cellular Base Station Antennas: Ideal for enhancing communication signals.
- RF Identification Tags: Perfect for applications requiring precise tracking.
- Automotive Radar and Sensors: Designed to meet the stringent requirements of automotive technologies.
- LNBs for Direct Broadcast Satellites: Ensuring high performance in satellite communications.
Quality Assurance
Manufactured in accordance with IPC-Class-2 standards, this PCB adheres to strict quality control measures, ensuring that each unit is durable and capable of performing under critical conditions.
Availability
This advanced PCB is available for purchase worldwide, providing you with the opportunity to integrate state-of-the-art technology into your electronic projects.
Conclusion
Elevate your electronic designs with our superior 8-layer RO4350B PCB. Its exceptional materials, meticulous construction, and rigorous quality assurance make it the perfect choice for high-performance applications in today’s fast-evolving technological landscape. Experience enhanced reliability and efficiency with our advanced PCB solutions.
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HDI RF PCB 8 Layer RO4350B Rogers 4350 Materials 1.6mm ENEPIG Images
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